Semiconductor & VLSI Consulting
TechVARE provides expert consulting for semiconductor teams working on ASIC design, FPGA prototyping, and chip verification — reducing risk at every stage of the development cycle.
A single ASIC re-spin costs millions of dollars and months of delay. Verification gaps, timing closure failures, and DFT oversights are the leading causes — and they are all preventable with the right expertise applied at the right stage.
TechVARE's semiconductor consulting practice brings hands-on VLSI engineers with production tape-out experience. We embed with your design teams to improve methodology, catch issues early, and build the verification infrastructure that enables confident sign-off.
What We Do
Verilog/VHDL design consulting, RTL code reviews, synthesis-ready deliverables, and micro-architecture advisory for ASIC and FPGA targets.
FPGA-based prototyping strategy, floor planning, implementation, and hardware validation to de-risk ASIC design decisions.
UVM testbench architecture, coverage-driven verification planning, random constraint modeling, and simulation regression strategy.
STA closure consulting, timing constraint authoring (SDC), critical path analysis, and clock domain crossing strategy.
Technical program management, risk identification, design review checkpoints, and milestone planning for complex chip programs.
Design for testability strategy — scan insertion, BIST, boundary scan, and test coverage planning for ASIC tape-out readiness.
Outcomes
30%
Reduction in design errors
Expert RTL review and front-loaded verification strategy catches bugs before simulation.
45%
Faster tape-out cycles
Structured milestone reviews and early STA closure accelerate chip program timelines.
2×
Verification efficiency
Coverage-driven UVM methodology replaces ad-hoc testing, finding more bugs per simulation cycle.
98.5%
Functional coverage achieved
Systematic coverage models ensure no functional scenario is left untested before tape-out.
Client Stories
Challenge
Ad-hoc verification leaving coverage gaps before tape-out
Approach
Implemented UVM-based verification methodology with functional coverage models and regression infrastructure.
Result
98.5% functional coverage — critical bugs caught 3 months early
Challenge
Timing closure failing for critical high-speed interface
Approach
STA constraint audit, clock skew analysis, path-specific timing exception strategy, and synthesis directive review.
Result
Timing closure achieved in 2 weeks without architectural changes
Challenge
First ASIC tape-out with no internal verification expertise
Approach
Embedded UVM consultant built testbench, trained team, and delivered coverage reports for sign-off.
Result
First-pass functional silicon achieved — no re-spin required
Talk to our semiconductor experts and discover how TechVARE can improve your verification coverage and accelerate tape-out.